Co-Package Technology Platform for Low-Power and Low-Cost Data Centers

We report recent advances in photonic–electronic integration developed the European research project L3MATRIX. The aim of was to demonstrate basic building blocks a co-packaged optical system. Two-dimensional silicon photonics arrays with 64 modulators were fabricated. Novel modulation schemes based on slow light assist achieving an efficient performance module. Integration DFB laser sources within each cell matrix demonstrated as well using wafer bonding between InP and SOI wafers. Improved semiconductor quantum dot MBE growth, characterization gain stack designs developed. Packaging these 2D photonic chiplet configuration vertical approach which interconnect flip-chip assembled top CMOS mimic chip fiber coupling. further substrate facilitate multi-chip module system switch surrounded by several such chiplets. summarize features L3MATRIX co-package technology platform its holistic toolbox technologies address next generation computing challenges.